The Hawk™ is a dry cleaning system for memory and logic device which provides a perfectly clean Si surface for deep contact plug integration and all of the Epi processes including Si, SiGe and III-V materials. 

• Single Wafer Dry Cleaning Process with Gas Chemicals
• Eugene's Own Dual Rotated Spiral ICP Antenna Plasma Source
• High Radical Density
• Plasma Damage Free
• Wide Range of Process Parameters

• Controllable Map, Concave or Convex
• Excellent Uniformity
• Good Coverage at Deep Contact
• High Throughput